Time flows, and smart manufacturing opens a new chapter! Amid the rapid advancement of electronic intelligent manufacturing, Youngpool Technology upholds the mission of “Making Electronics Manufacturing Simpler.” We remain focused on the R&D and innovation of SMT intelligent equipment and solutions, dedicated to delivering more efficient and reliable production line experiences for the industry.

        On September 4, the CEIA Conductive@ Smart Manufacturing and High Reliability – From Advanced Packaging to Electronics Assembly Innovation Forum will grandly open in Xi’an. As an invited enterprise, Youngpool Technology will join hands with industry experts and partners to explore “New Smart Manufacturing · Core Future” in the AI era. We sincerely invite you to attend and witness the new trends in electronics manufacturing with us!

Xi'an Station

CEIA Conductive@ Smart Manufacturing and High Reliability Forum

Gain insights into cutting-edge technology directions

Build the future of electronics manufacturing together

Youngpool Technology will showcase intelligent equipment solutions covering key SMT production line processes:

Intelligent Splicing Machine Series: Fast splicing (≤7s), high pass-through rate (98%), supporting intelligent vision and MES integration.

Laser Marking Machine Series: Multiple light sources optional, mark-and-read capability, high precision, and stable efficiency.

Vacuum Defoaming Machine: Vacuum mode for rapid bubble removal, enhancing packaging reliability.

Dry Ultrasonic Cleaning Machine: Consumable-free, non-contact cleaning, damage-free, eco-friendly, and efficient.

Laser Depaneling Machine: High precision (±2μm), fast and stable, ideal for large-size PCB precision depaneling.

Event Information

Date: September 4, 2025

Venue: Grand Ballroom, G Floor, Wyndham Grand Xi’an South

We sincerely invite you to join us at the Xi’an Forum and co-create the blueprint for the future of smart manufacturing!